384×288 Resolution Thermal Camera Core with 8μm to 14μm Spectral Range and Uncooled Focal Plane Arrays

The COIN417G3 infrared camera core is equipped with a 384×288/17μm wafer-level infrared detector and enhanced by professional image processing algorithms, enabling fast and clear image output. It features ultra-low power consumption and full compatibility with industry-standard interfaces, making it highly versatile for applications such as industrial vision, night-time surveillance, outdoor observation, and AIoT. This camera core offers strong support for secondary development and system integration, accelerating the time-to-market of infrared imaging systems.

• Comprehensive Functionality, Cost-Effective Design - Developed using high cost-performance wafer-level packaging detector with integrated advanced image processing algorithms
• Outstanding Performance, Superior Imaging - High sensitivity with typical NETD≤30mK and next-generation image algorithms for clearer, sharper thermal images
• Flexible Extension, Rapid Integration - Multiple optical lens options, supports USB2.0/DVP/LVDS/BT.656 interfaces, outputs RAW/YUV image data with serial port control

• Non-uniformity Correction (NUC)
• 3D Noise Reduction (3DNR)
• 2D Noise Suppression (DNS)
• Dynamic Range Compression (DRC)
• Edge Enhancement (EE)

We provide excellent technical support for our thermal camera core product. Our engineers are available to provide guidance, answer questions, and provide troubleshooting assistance.

We offer a comprehensive warranty service covering any manufacturer defects during the warranty period, including free repair or replacement services for defective products.

If you have any questions about our Thermal Camera Core product or need technical assistance, please contact us. We are here to help.